SoftRank: 6.96 |
You can immediately begin to create three-dimensional elements without needing to start from a two-dimensional plan. Elements such as walls, floors, roofs, and stairs are created from the onset in their full three-dimensional form. Watch the 3D model change in real-time as you design in plan.
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SoftRank: 6.82 |
First Encounter provides a clear path to synthesize to a virtual prototype implementation including full-chip, routed wires—right at the beginning of the design cycle. |
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SoftRank: 6.82 |
Fire & Ice QXC has redefined the accuracy requirements for cell-based digital designs—it is 2X more accurate as other extraction technologies and handles in-die process variations that often occur in advanced processes as 130nm and below. |
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SoftRank: 6.82 |
A silicon-proven, 3D, hierarchical, grid-less, space-based, full-chip and block routing convergence system for advanced mixed-signal, analog, and custom digital designs at 65nm and below. |
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SoftRank: 6.82 |
Allows electrical engineers to develop and embed optimum constraints during design creation phase. It’s tightly integrated with the proven simulation technology of Allegro Design Entry HDL. |
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SoftRank: 6.82 |
Encounter Conformal offers the most comprehensive solution for equivalence checking, design-constraint management, and low-power design verification. |
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SoftRank: 6.82 |
Leading physical and electrical constraint-driven PCB layout system that addresses performance and a wide range of design, testability, and manufacturing challenges. |
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SoftRank: 6.82 |
A comprehensive constraint-driven schematic design solution highly integrated within the Allegro platform with extensive simulation and verification options. |
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SoftRank: 6.82 |
SoC Encounter is a high-capacity, hierarchical, RTL-to-GDSII implementation system that combines RTL synthesis, silicon virtual prototyping, and full-chip implementation in a single system. |
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SoftRank: 6.82 |
Streamlines IC package design and co-design through a complete constraint-driven physical design solution that supports virtually all packaging methods. |
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