Cadence® SiP Digital Layout
Comprises a complete constraint- and rules-driven package substrate layout environment that supports packaging methods, including PGA, BGA, MICRO-BGA, chip scale, and flip-chip/wirebond attach methods.
Supported Technologies
HP/UX,
Solaris/Sun OS,
Linux
Software
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Pricing
- Unspecified -
http://www.cadence.com/company/cadence_worldwide/offices.aspx
800.746.6223, 408.954.1234
Resources
Additional Product Information
Comprises a complete constraint- and rules-driven package substrate layout environment that supports packaging methods, including PGA, BGA, MICRO-BGA, chip scale, and flip-chip/wirebond attach methods.