Electrical Engineering Software (41-50 of 53)

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SoftRank: 1.75

ApsimRLGC is program to calculate the electrical parameters of a transmission line cross section. In particular it calculates the capacitance, inductance, resistance and conductance matrices associated with coupled lossy transmission lines.

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SoftRank: 1.75

RAM CommanderRAM Commander is modular software allowing a customer the flexibility of gradual addition of the modules to the package in accordance with the requirements of a project or the budget constraints.

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SoftRank: 1.71

ADWA a program that protects you from the dangers of the internet, profiteers, and internet criminals. It is available in multi-languages. It scans all user accounts and shreds the detected spyware threats files and folders.

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SoftRank: 1.48

As operating frequencies reach 1GHz and beyond noise introduced from the interconnect and power distribution system must accurately be accounted for in both PCB and IC design. Such noise can destroy timing budgets and cause functional failures. Simulation of these Signal Integrity issues has become...

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SoftRank: 1.48

ApsimSI can verify reflection and crosstalk noise along traces in layout designs using the most accurate lossy coupled transmission line simulator ApsimSPICE, fast transmission line parameter extractor ApsimRLGC and layout modeler ApsimLIF. ApsimSI is integrated with PCB and MCM CAD systems

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SoftRank: 1.35

Powerful process and instrumentation diagram software for AutoCAD. Makes the creation of smart process and instrumentation diagrams, loop sheets and other flow diagrams quick and easy.

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SoftRank: 1.27

MemChar provides complete solution for automation in memory characterization.

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SoftRank: 1.27

SpiceCut is a leading edge solution for automation in generating accurate critical path circuits for spice simulations.

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SoftRank: 1.27

MSIM is a characterization-oriented spice circuit simulator, which offers high speed and high accuracy for standard cell and memory characterization.

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SoftRank: 1.20

ApsimIBIS-LCR is a software tool for electrical characterization of various IC packaging technologies.

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