CELSIUS – 3D Thermal Program
Used for applications such as cooling fins, heat sinks, chip packaging, and motor cooling, coupled analysis is obtained with CELSIUS by using the electromagnetic power loss or force output as input for thermal analysis.
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Supported Technologies
Windows XP/2000/NT
Software
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Pricing
- Unspecified -
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204-632-5636
Resources
Additional Product Information
CELSIUS features include:
Display temperature, temperature gradient and heat flux values using contour plots, profile plots, arrow plots and graphs Static and phasor analysis modes
Easily assign boundary conditions such as temperature, heat flux, temperature gradient, convective and radiative heat exchange
Assign heat sources in the form of volume heat and surface heat
Material table stores thermal conductivity, specific heat, mass density or absorption and scattering coefficients