KELVIN – 2D/RS Thermal Analysis Software
Used for applications such as cooling fins, heat sinks, chip packaging, and motor cooling, KELVIN also provides coupled analysis with OERSTED, IES’ 2D/RS eddy current field solver.
Supported Technologies
Windows XP/2000/NT
Software
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Pricing
- Unspecified -
info@integratedsoft.com
204-632-5636
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Additional Product Information
KELVIN incorporates Integrated Engineering Software's (IES) Hybrid BE-FE Method for solving electrothermal problems. The Hybrid BE-FE Method combines the strengths of both the Boundary Element Method (BEM) and the Finite Element Method (FEM) to provide faster and more accurate solutions.
Coupling KELVIN with OERSTED (IES’ 2D/RS eddy current field solver) provides multiphysics analysis capabilities. A direct link automatically takes the output from one program and inputs it into the other.
KELVIN’s parametric solver also allows designers to automatically vary and experiment with geometry, materials and sources, reducing the tedious, repetitive task of fine-tuning multiple design parameters.
Other KELVIN features include:
Display temperature, temperature gradient and heat flux values using contour plots, profile plots, arrow plots and graphs
Easily assign boundary conditions such as temperature, heat flux, temperature gradient, convective and radiative heat exchange
Assign heat sources in the form of volume heat and surface heat
Material table stores thermal conductivity, specific heat, mass density or absorption and scattering coefficients