RealPower
RealPower Solution ANALYZE power using the actual test vectors. FIND reliability problems (electromigration, hot spots & IR drop) fast and FIX reliability issues using the built-in Power Mesh Design feature.
English
Supported Technologies
HP/UX,
Linux,
Solaris/Sun OS
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Pricing
- Unspecified -
sales@iota.com
408-428-9898 x 10
Resources
Additional Product Information
Reliability...at .35 micron and below.;It is important for a design engineer to verify that every module of the chip operates within the power budget, and that the chip will meet system-level power, heat sink, and battery lifetime specifications. What's more, at 0.35um and below, IR (voltage) drop, electromigration, and via reliability problems caused by excessive current densities are becoming serious concerns. Low-level power consumption data must be used early in the IC design flow, to ensure that electric current will not damage the very thin metal lines and the even smaller via's (metallic plugs that connect between the metal layers) on the IC surface.;Key Features:;Graphical display of power on floorplan ;IR (voltage) drop analysis ;Power rail & signal electromigration analysis ;Reliability analysis (Hot Spots/Vias) ;Power Mesh design based on actual power consumed ;Peak, average and worst case power display ;Supports very large set of test vectors ;All input formats are industry standard ;Key Benefits;Improve reliability & reduce risk of field failures/design re-spins ;Integrated solution to reduce design iterations ;Reduce area penalty due to "over designing" ;Reduce the need for expensive packaging ;Utilize early in design cycle where problems are easier & cheaper to fix